Features:
1. High temperature resistance, low temperature, good thermal conductivity.
2. Soft, low viscosity.
3. Can be used for CPU chip heat conduction or LED heat conduction.
4. Good heat conduction, very good malleability.
5. Can be cut to any desired size.
Specifications:
Condition: 100% Brand New
Material: Silica Gel
Color: Blue
Size: Approx. 100 * 100 * 3 mm / 3.9 * 3.9 * 0.1 in
Thermal Conductivity: 5.0
Density: 2.35
Hardness: 13c - 50c
Permittivity: 260±18
Temperature: -40°C - 220°C
Voltage Resistance: > 4kv
Fire Resistance: UL94 V0
Tensile Strength:(PSI)≥35
Package Included:
1 x CPU Thermal Pad
Notes:
1.Please allow 1-3 cm error due to manual measurement. Thanks for your understanding.
2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.
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