RELIFE 35g BGA Tin Solder Paste No-clean Syringe Liquid Flux Melting Point 183 degrees PCB Soldering iron Repair Welding Fluxes
Feature:
100% brand new and high quality
Unique formula, perfect performance, easy welding, bright and complete welding, no welding, false welding, etc.
Welding and welding are also good.
Applications: Mobile phone repair, computer and digital services, high-precision circuit board welding, BGA welding process, etc.
specification：
Viscosity: 160-230 Pa
Chart size: 20-38um
Packing list：
Solder paste*1
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